§ 850.201 Advanced packaging.

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Title 31 CFR: Money and Finance: Treasury › Chapter VIII: OFFICE OF INVESTMENT SECURITY, DEPARTMENT OF THE TREASURY › Part 850: PROVISIONS PERTAINING TO U.S. INVESTMENTS IN CERTAIN NATIONAL SECURITY TECHNOLOGIES AND PRODUCTS IN COUNTRIES OF CONCERN › Subpart B: Definitions › § 850.201: § 850.201 Advanced packaging.

This text was captured on Aug 14, 2026. It is a snapshot, not a live feed, so check the official code before relying on it.

Text

The term

advanced packaging

means to package integrated circuits in a manner that supports the two-and-one-half-dimensional (2.5D) or three-dimensional (3D) assembly of integrated circuits, such as by directly attaching one or more die or wafer using through-silicon vias, die or wafer bonding, heterogeneous integration, or other advanced methods and materials.

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